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This is a flexible composite
of polyimide film and copper foil bonded with heat-resistance modified
epoxy adhesive. It is designed for use in the flexible printed circuits.
The laminate can be processed through conventional printing, etching and
plating techniques in manufacture of flexi ble printed circuits.
Characteristics:
- Excellent heat resistance, mechanical strength and electrical properties
of polyimide film in high temperature.
- Good dimensional stability
- High solder float resistance
- Self-extinguishing and flame retardant
pi-copper
| Part Number |
Film(mils) |
Foil(¦Ì) |
FoilType |
S/D* |
| LPI1ED18/S |
1 |
18 |
EDHD |
S |
| LPI2ED18/S |
2 |
18 |
EDHD |
S |
| LPI1ED35/S |
1 |
35 |
EDHD |
S |
| LPI2ED35/S |
2 |
35 |
EDHD |
S |
| LPI1ED70/S |
1 |
70 |
EDHD |
S |
| LPI2ED70/S |
2 |
70 |
EDHD |
S |
| LPI1RA18/S |
1 |
18 |
RA |
S |
| LPI2RA18/S |
2 |
18 |
RA |
S |
| LPI1RA35/S |
1 |
35 |
RA |
S |
| LPI2RA35/S |
2 |
35 |
RA |
S |
| LPI1RA70/S |
1 |
70 |
RA |
S |
| LPI2RA70/S |
2 |
70 |
RA |
S |
|
| LPI1ED18/D |
1 |
18 |
EDHD |
D |
| LPI2ED18/D |
2 |
18 |
EDHD |
D |
| LPI1ED35/D |
1 |
35 |
EDHD |
D |
| LPI2ED35/D |
2 |
35 |
EDHD |
D |
| LPI1ED70/D |
1 |
70 |
EDHD |
D |
| LPI2ED70/D |
2 |
70 |
EDHD |
D |
| LPI1RA18/D |
1 |
18 |
RA |
D |
| LPI2RA18/D |
2 |
18 |
RA |
D |
| LPI1RA35/D |
1 |
35 |
RA |
D |
| LPI2RA35/D |
2 |
35 |
RA |
D |
| LPI1RA70/D |
1 |
70 |
RA |
D |
| LPI2RA70/D |
2 |
70 |
RA |
D |
Note:
¡¤ EDHD:Electrodeposited High-ductility Copper; RA:Rolled Annealed Copper
¡¤ Structure of laminate:Single Side(S);Double Sides(D)
¡¤ Product type above listed is Non-FR product part number,while FR product
part number is added-FR at the end of Non-FR product part number.
Applications:
*FPC (flexible printed circuits)
Remarks: Profma International Co.,Ltd.is also able to supply Copper adhesive
tapes(non-conductive and conductive).
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Polyimide/Kapton